Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10098179 | Electronic device | Shintaro Yamamichi, Masaki Watanabe, Junichi Arita, Norio Okada, Jun UENO +3 more | 2018-10-09 |
| 9635762 | Semiconductor package | Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Hiroshi Demachi, Takeshi Miyakoshi +8 more | 2017-04-25 |
| 9368474 | Manufacturing method for semiconductor device | Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hiroshi Demachi +8 more | 2016-06-14 |
| 9362262 | Semiconductor device | Shintaro Yamamichi, Manabu Okamoto | 2016-06-07 |
| 9362200 | Heat sink in the aperture of substrate | Shinji Watanabe, Toshihiro Iwasaki, Kiminori Ishido, Koichiro Niwa, Takeshi Miyakoshi +6 more | 2016-06-07 |
| 9117814 | Semiconductor device | Shintaro Yamamichi, Manabu Okamoto | 2015-08-25 |
| 8389414 | Method of manufacturing a wiring board | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more | 2013-03-05 |
| 8324718 | Warp-suppressed semiconductor device | — | 2012-12-04 |
| 8304905 | Semiconductor device | Satoshi Matsui, Tsuyoshi Eda, Akira Matsumoto, Yoshitaka Kyougoku, Shinji Watanabe | 2012-11-06 |
| 8198140 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2012-06-12 |
| 8008130 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board | — | 2011-08-30 |
| 7911038 | Wiring board, semiconductor device using wiring board and their manufacturing methods | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more | 2011-03-22 |
| 7838779 | Wiring board, method for manufacturing same, and semiconductor package | Shintaro Yamamichi, Katsumi Kikuchi, Hideya Murai, Takuo Funaya, Takehiko Maeda +2 more | 2010-11-23 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2010-10-19 |
| 7728440 | Warp-suppressed semiconductor device | — | 2010-06-01 |
| 7674989 | Wiring board and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Takehiko Maeda +2 more | 2010-03-09 |
| 7566834 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Keiichiro Kata | 2009-07-28 |
| 7498249 | Method of forming a connecting conductor and wirings of a semiconductor chip | Shinichi Miyazaki, Kenji Ooyachi | 2009-03-03 |
| 7397000 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Keiichiro Kata | 2008-07-08 |
| 7348673 | Semiconductor device | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Koji Soejima, Shinichi Miyazaki | 2008-03-25 |
| 7233066 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Kazuhiro Baba, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more | 2007-06-19 |
| 7217999 | Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board | — | 2007-05-15 |
| 7138064 | Semiconductor device and method of manufacturing the same | — | 2006-11-21 |
| 7074650 | Flip-chip type semiconductor device and method of manufacturing the same | — | 2006-07-11 |
| 7060604 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Kazuhiro Baba, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more | 2006-06-13 |