Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198140 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2012-06-12 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2010-10-19 |
| 7566834 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Hirokazu Honda | 2009-07-28 |
| 7397000 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Hirokazu Honda | 2008-07-08 |
| 7233066 | Multilayer wiring substrate, and method of producing same | Hirokazu Honda, Kazuhiro Baba, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more | 2007-06-19 |
| RE39603 | Process for manufacturing semiconductor device and semiconductor wafer | Shinichi Chikaki | 2007-05-01 |
| 7060604 | Multilayer wiring substrate, and method of producing same | Hirokazu Honda, Kazuhiro Baba, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more | 2006-06-13 |
| 6339337 | Method for inspecting semiconductor chip bonding pads using infrared rays | Shuichi Matsuda, Ryoji Sato, Masaharu Sato | 2002-01-15 |
| 6201298 | Semiconductor device using wiring tape | Ryoji Sato, Masanori Takeuchi | 2001-03-13 |
| 6114754 | Tape automated bonding film | — | 2000-09-05 |
| 5977617 | Semiconductor device having multilayer film carrier | — | 1999-11-02 |
| 5905303 | Method for manufacturing bump leaded film carrier type semiconductor device | Shuichi Matsuda, Eiji Hagimoto | 1999-05-18 |
| 5897337 | Process for adhesively bonding a semiconductor chip to a carrier film | Shuichi Matsuda | 1999-04-27 |
| 5844304 | Process for manufacturing semiconductor device and semiconductor wafer | Shinichi Chikaki | 1998-12-01 |
| 5759873 | Method of manufacturing chip-size package-type semiconductor device | Shuichi Matsuda, Hironori Ono | 1998-06-02 |
| 5757068 | Carrier film with peripheral slits | Shuichi Matsuda | 1998-05-26 |
| 5726489 | Film carrier semiconductor device | Shuichi Matsuda | 1998-03-10 |
| 5683942 | Method for manufacturing bump leaded film carrier type semiconductor device | Shuichi Matsuda, Eiji Hagimoto | 1997-11-04 |
| 5292574 | Ceramic substrate having wiring of silver series | Yuzo Shimada | 1994-03-08 |
| 5283081 | Process for manufacturing a ceramic wiring substrate having a low dielectric constant | Yoshinobu Kobayashi, Yuzo Shimada | 1994-02-01 |
| 5283210 | Low temperature sintering low dielectric inorganic composition | Yuzo Shimada | 1994-02-01 |