Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5969417 | Chip package device mountable on a mother board in whichever of facedown and wire bonding manners | Koji Yamashita, Yasunori Tanaka | 1999-10-19 |
| 5909055 | Chip package device mountable on a mother board in whichever of facedown and wire bonding manners | Koji Yamashita, Yasunori Tanaka | 1999-06-01 |
| 5905303 | Method for manufacturing bump leaded film carrier type semiconductor device | Keiichiro Kata, Shuichi Matsuda | 1999-05-18 |
| 5683942 | Method for manufacturing bump leaded film carrier type semiconductor device | Keiichiro Kata, Shuichi Matsuda | 1997-11-04 |