SM

Shuichi Matsuda

Mitsubishi Electric: 9 patents #3,275 of 25,717Top 15%
NE Nec: 8 patents #1,742 of 14,502Top 15%
NE Nec Electronics: 3 patents #234 of 1,789Top 15%
SC Shionogi & Co.: 2 patents #396 of 1,054Top 40%
UN Unknown: 2 patents #12,644 of 83,584Top 20%
YE Yokogawa Electric: 1 patents #658 of 1,441Top 50%
Kyocera: 1 patents #2,054 of 3,732Top 60%
JM Japan Medical Materials: 1 patents #1 of 12Top 9%
📍 Kashiwa, JP: #28 of 653 inventorsTop 5%
Overall (All Time): #154,597 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 1–25 of 26 patents

Patent #TitleCo-InventorsDate
10327860 Measurement instrument for joint surgery Masahiko Hashida, Yuichi Enomoto 2019-06-25
9886564 Server system, communication system, communication terminal device, program, recording medium, and communication method Haruhiko Fujii 2018-02-06
8246570 Device for cell transplantation Yukihide Iwamoto, Koichi Nakayama, Hiromasa Miura, Kazuhiro Tanaka 2012-08-21
7268439 Semiconductor device having resin-sealed area on circuit board thereof 2007-09-11
7084511 Semiconductor device having resin-sealed area on circuit board thereof 2006-08-01
6858230 Process for producing medicinal composition of basic hydrophobic medicinal compound Hidekazu Shodai, Noboru Nagafuji, Yusuke Suzuki 2005-02-22
6794750 Semiconductor device 2004-09-21
6632452 Medicinal compositions retarded in the discoloration of phenolic hydroxyl compounds Hidekazu Shodai, Noboru Nagafuji 2003-10-14
6339337 Method for inspecting semiconductor chip bonding pads using infrared rays Keiichiro Kata, Ryoji Sato, Masaharu Sato 2002-01-15
5905303 Method for manufacturing bump leaded film carrier type semiconductor device Keiichiro Kata, Eiji Hagimoto 1999-05-18
5897337 Process for adhesively bonding a semiconductor chip to a carrier film Keiichiro Kata 1999-04-27
5759873 Method of manufacturing chip-size package-type semiconductor device Keiichiro Kata, Hironori Ono 1998-06-02
5757078 Semiconductor device with increased multi-bumps and adhered multilayered insulating films and method for installing same Kazutaka Shoji 1998-05-26
5757068 Carrier film with peripheral slits Keiichiro Kata 1998-05-26
5726489 Film carrier semiconductor device Keiichiro Kata 1998-03-10
5683942 Method for manufacturing bump leaded film carrier type semiconductor device Keiichiro Kata, Eiji Hagimoto 1997-11-04
5424932 Multi-output switching power supply having an improved secondary output circuit Kiyoharu Inou 1995-06-13
5322748 Photomask and a method of manufacturing thereof comprising trapezoidal shaped light blockers covered by a transparent layer Yaichiro Watakabe 1994-06-21
4985319 Process for manufacturing a photomask Yaichiro Watakabe, Tatsuo Okamoto 1991-01-15
4957834 Method for manufacturing photomask Yaichiro Watakabe 1990-09-18
4876164 Process for manufacturing a photomask Yaichiro Watakabe, Tatsuo Okamoto 1989-10-24
4792461 Method of forming a photomask material Yaichiro Watakabe 1988-12-20
4783371 Photomask material Yaichiro Watakabe 1988-11-08
4738907 Process for manufacturing a photomask Akira Shigetomi 1988-04-19
4717625 Photomask material Yaichiro Watakabe 1988-01-05