| 8840313 |
Bearing apparatus for a wheel of vehicle |
Kazuo Komori, Masahiro Kiuchi |
2014-09-23 |
|
| 8313242 |
Sensor-equipped bearing for wheel |
Takayuki Norimatsu, Toru Takahashi, Kazuo Komori, Kentarou Nishikawa |
2012-11-20 |
|
| 8198140 |
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more |
2012-06-12 |
|
| 8123411 |
Sensor-equipped bearing for wheel |
Takayuki Norimatsu, Toru Takahashi, Kazuo Komori, Kentarou Nishikawa |
2012-02-28 |
|
| 7832941 |
Bearing apparatus for a wheel of vehicle |
Kazuo Komori |
2010-11-16 |
|
| 7816782 |
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package |
Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more |
2010-10-19 |
|
| 7748909 |
Bearing apparatus for a wheel of vehicle |
Kazuo Komori, Kazunori Kubota, Takayuki Norimatsu, Akira Fujimura, Shinji Morita |
2010-07-06 |
$656,000 |
| 7745736 |
Interconnecting substrate and semiconductor device |
Kenta Ogawa, Jun Tsukano, Takehiko Maeda, Tadanori Shimoto, Shintaro Yamamichi |
2010-06-29 |
|
| 7696007 |
Semiconductor package board using a metal base |
Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui |
2010-04-13 |
|
| 7641394 |
Bearing apparatus for a wheel of vehicle |
Kazuo Komori, Kazunori Kubota |
2010-01-05 |
$635,000 |
| 7585699 |
Semiconductor package board using a metal base |
Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui |
2009-09-08 |
|
| 7566834 |
Wiring board and semiconductor package using the same |
Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Hirokazu Honda, Keiichiro Kata |
2009-07-28 |
|
| 7474538 |
Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package |
Katsumi Kikuchi, Tadanori Shimoto |
2009-01-06 |
|
| 7397000 |
Wiring board and semiconductor package using the same |
Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Hirokazu Honda, Keiichiro Kata |
2008-07-08 |
|
| 7338884 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Tadanori Shimoto, Katsumi Kikuchi, Koji Matsui |
2008-03-04 |
|
| 7294393 |
Sheet material and wiring board |
Hideya Murai, Tadanori Shimoto, Katsumi Kikuchi |
2007-11-13 |
|
| 7233066 |
Multilayer wiring substrate, and method of producing same |
Keiichiro Kata, Hirokazu Honda, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more |
2007-06-19 |
$49,000 |
| 7060604 |
Multilayer wiring substrate, and method of producing same |
Keiichiro Kata, Hirokazu Honda, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more |
2006-06-13 |
$33,000 |
| 6861757 |
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
Tadanori Shimoto, Katsumi Kikuchi, Koji Matsui |
2005-03-01 |
$42,000 |
| 6841862 |
Semiconductor package board using a metal base |
Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui |
2005-01-11 |
$31,000 |
| 6607445 |
Game execution method and equipment using player data |
Katsunori Gendo, Takashi Iizuka |
2003-08-19 |
|
| 6364819 |
Fastening device for joining two plates together |
Yoshiaki Shinno, Toshikazu Sanda, Minoru Isayama, Yuko Ogawa |
2002-04-02 |
$199,000 |
| 5975534 |
Sealing device |
Eiji Tajima, Shinji Nishio |
1999-11-02 |
|
| 5930077 |
Magnetic head for recording and reproducing a signal and comprising a slider provided with a protective film including an intermediate layer and an amorphous hard carbon layer |
Takeshi Obata |
1999-07-27 |
$19,000 |
