Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8840313 | Bearing apparatus for a wheel of vehicle | Kazuo Komori, Masahiro Kiuchi | 2014-09-23 |
| 8313242 | Sensor-equipped bearing for wheel | Takayuki Norimatsu, Toru Takahashi, Kazuo Komori, Kentarou Nishikawa | 2012-11-20 |
| 8198140 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2012-06-12 |
| 8123411 | Sensor-equipped bearing for wheel | Takayuki Norimatsu, Toru Takahashi, Kazuo Komori, Kentarou Nishikawa | 2012-02-28 |
| 7832941 | Bearing apparatus for a wheel of vehicle | Kazuo Komori | 2010-11-16 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Tadanori Shimoto, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi +4 more | 2010-10-19 |
| 7748909 | Bearing apparatus for a wheel of vehicle | Kazuo Komori, Kazunori Kubota, Takayuki Norimatsu, Akira Fujimura, Shinji Morita | 2010-07-06 |
| 7745736 | Interconnecting substrate and semiconductor device | Kenta Ogawa, Jun Tsukano, Takehiko Maeda, Tadanori Shimoto, Shintaro Yamamichi | 2010-06-29 |
| 7696007 | Semiconductor package board using a metal base | Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui | 2010-04-13 |
| 7641394 | Bearing apparatus for a wheel of vehicle | Kazuo Komori, Kazunori Kubota | 2010-01-05 |
| 7585699 | Semiconductor package board using a metal base | Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui | 2009-09-08 |
| 7566834 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Hirokazu Honda, Keiichiro Kata | 2009-07-28 |
| 7474538 | Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package | Katsumi Kikuchi, Tadanori Shimoto | 2009-01-06 |
| 7397000 | Wiring board and semiconductor package using the same | Tadanori Shimoto, Katsumi Kikuchi, Hideya Murai, Hirokazu Honda, Keiichiro Kata | 2008-07-08 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device | Tadanori Shimoto, Katsumi Kikuchi, Koji Matsui | 2008-03-04 |
| 7294393 | Sheet material and wiring board | Hideya Murai, Tadanori Shimoto, Katsumi Kikuchi | 2007-11-13 |
| 7233066 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Hirokazu Honda, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more | 2007-06-19 |
| 7060604 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Hirokazu Honda, Tadanori Shimoto, Katsumi Kikuchi, Rokuro Kambe +2 more | 2006-06-13 |
| 6861757 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device | Tadanori Shimoto, Katsumi Kikuchi, Koji Matsui | 2005-03-01 |
| 6841862 | Semiconductor package board using a metal base | Katsumi Kikuchi, Tadanori Shimoto, Koji Matsui | 2005-01-11 |
| 6607445 | Game execution method and equipment using player data | Katsunori Gendo, Takashi Iizuka | 2003-08-19 |
| 6364819 | Fastening device for joining two plates together | Yoshiaki Shinno, Toshikazu Sanda, Minoru Isayama, Yuko Ogawa | 2002-04-02 |
| 5975534 | Sealing device | Eiji Tajima, Shinji Nishio | 1999-11-02 |
| 5930077 | Magnetic head for recording and reproducing a signal and comprising a slider provided with a protective film including an intermediate layer and an amorphous hard carbon layer | Takeshi Obata | 1999-07-27 |