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USPTO Patent Rankings Data through Dec 31, 2025
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Jun Tsukano — 14 Patents

NENec Electronics: 6 patents #86 of 1,789Top 5%
Nec: 6 patents #2,379 of 14,502Top 20%
RERenesas Electronics: 4 patents #1,016 of 4,529Top 25%
Canon: 4 patents #10,169 of 19,416Top 55%
Tokyo, JP: #11,195 of 90,295 inventorsTop 15%
Overall (All Time): #332,869 of 4,157,543Top 9%
14 Patents All Time
Jun Tsukano has been granted 14 US patents while listed as an inventor at Nec. The first was granted in 2004 and the most recent in May 2025. Jun Tsukano ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Jun Tsukano in Tokyo, JP.

Patents per Year

Patents granted per year, 2004 to 2025Bar chart with a peak of 5 patents in 2010.peak 52004: 1 patents20042010: 5 patents20102011: 2 patents20112012: 1 patents20122013: 1 patents20132022: 2 patents20222023: 1 patents20232025: 1 patents2025

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12292657 Electronic component, manufacturing method thereof, and electronic apparatus — 2025-05-06
11765448 Electronic component including electronic substrate and circuit member, apparatus, and camera — 2023-09-19
11528392 Electronic component including electronic substrate and circuit member, apparatus, and camera — 2022-12-13 $22,000
11448914 Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device — 2022-09-20 $40,000
8389414 Method of manufacturing a wiring board Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more 2013-03-05
8304918 Method for manufacturing electronic device and electronic device — 2012-11-06
7911038 Wiring board, semiconductor device using wiring board and their manufacturing methods Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more 2011-03-22
7888809 Semiconductor device and method of manufacturing the same Yuichi Miyagawa, Takamitsu Noda, Hiroyasu Miyamoto 2011-02-15
7838779 Wiring board, method for manufacturing same, and semiconductor package Shintaro Yamamichi, Katsumi Kikuchi, Hideya Murai, Takuo Funaya, Takehiko Maeda +2 more 2010-11-23
7745736 Interconnecting substrate and semiconductor device Kenta Ogawa, Takehiko Maeda, Tadanori Shimoto, Shintaro Yamamichi, Kazuhiro Baba 2010-06-29
7701726 Method of manufacturing a wiring substrate and semiconductor device Kenta Ogawa, Takehiko Maeda, Shintaro Yamamichi, Katsumi Kikuchi 2010-04-20
7674989 Wiring board and method for manufacturing the same Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Takehiko Maeda +2 more 2010-03-09
7649749 Wiring substrate, semiconductor device, and method of manufacturing the same Kenta Ogawa, Takehiko Maeda, Shintaro Yamamichi, Katsumi Kikuchi 2010-01-19
6762488 Light thin stacked package semiconductor device and process for fabrication thereof Takehiko Maeda 2004-07-13 $48,000

Frequent Collaborators

Takehiko Maeda8 shared
Kenta Ogawa7 shared
Shintaro Yamamichi7 shared
Katsumi Kikuchi6 shared
Takuo Funaya4 shared
Hideya Murai4 shared

Nearby-Ranked Inventors

Ke PAN14
Naor Radami14
Jason Harris14
Gwangjae Jeon14
Masao Zen14
Yoshihiro YAMASAKI14
Sanjay Vakil14
Samuel Bartlett14
Taketoshi Okuno14