Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198140 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi, Kazuhiro Baba +4 more | 2012-06-12 |
| 7816782 | Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package | Hideya Murai, Takuo Funaya, Katsumi Kikuchi, Shintaro Yamamichi, Kazuhiro Baba +4 more | 2010-10-19 |
| 7745736 | Interconnecting substrate and semiconductor device | Kenta Ogawa, Jun Tsukano, Takehiko Maeda, Shintaro Yamamichi, Kazuhiro Baba | 2010-06-29 |
| 7696007 | Semiconductor package board using a metal base | Katsumi Kikuchi, Koji Matsui, Kazuhiro Baba | 2010-04-13 |
| 7585699 | Semiconductor package board using a metal base | Katsumi Kikuchi, Koji Matsui, Kazuhiro Baba | 2009-09-08 |
| 7566834 | Wiring board and semiconductor package using the same | Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Hirokazu Honda, Keiichiro Kata | 2009-07-28 |
| 7474538 | Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package | Katsumi Kikuchi, Kazuhiro Baba | 2009-01-06 |
| 7397000 | Wiring board and semiconductor package using the same | Katsumi Kikuchi, Hideya Murai, Kazuhiro Baba, Hirokazu Honda, Keiichiro Kata | 2008-07-08 |
| 7338884 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device | Katsumi Kikuchi, Koji Matsui, Kazuhiro Baba | 2008-03-04 |
| 7294393 | Sheet material and wiring board | Hideya Murai, Kazuhiro Baba, Katsumi Kikuchi | 2007-11-13 |
| 7233066 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Hirokazu Honda, Kazuhiro Baba, Katsumi Kikuchi, Rokuro Kambe +2 more | 2007-06-19 |
| 7060604 | Multilayer wiring substrate, and method of producing same | Keiichiro Kata, Hirokazu Honda, Kazuhiro Baba, Katsumi Kikuchi, Rokuro Kambe +2 more | 2006-06-13 |
| 6861757 | Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device | Katsumi Kikuchi, Koji Matsui, Kazuhiro Baba | 2005-03-01 |
| 6841862 | Semiconductor package board using a metal base | Katsumi Kikuchi, Koji Matsui, Kazuhiro Baba | 2005-01-11 |
| 6798070 | Electronic device assembly and a method of connecting electronic devices constituting the same | Takuo Funaya, Naoji Senba, Koji Matsui | 2004-09-28 |
| 6576499 | Electronic device assembly and a method of connecting electronic devices constituting the same | Takuo Funaya, Naoji Senba, Koji Matsui | 2003-06-10 |
| 6444403 | Resin laminated wiring sheet, wiring structure using the same, and production method thereof | Koji Matsui, Takero Teramoto, Hironobu Kawasato | 2002-09-03 |
| 6333136 | Carrier film and process for producing the same | Koji Matsui | 2001-12-25 |
| 6278153 | Thin film capacitor formed in via | Katsumi Kikuchi, Koji Matsui, Akinobu Shibuya | 2001-08-21 |
| 6204565 | Semiconductor carrier and method for manufacturing the same | Koji Matsui | 2001-03-20 |
| 6156414 | Carrier film and process for producing the same | Koji Matsui | 2000-12-05 |
| 6150074 | Method of forming electrically conductive wiring pattern | Koji Matsui | 2000-11-21 |
| 5889233 | Multilayer wiring structure | Koji Matsui | 1999-03-30 |
| 5830563 | Interconnection structures and method of making same | Yoshitsugu Funada, Koji Matsui, Yuzo Shimada, Kazuaki Utsumi | 1998-11-03 |
| 5712506 | Semiconductor device with passivation layer of benzocyclobutene polymer and silicon powder | Koji Matsui | 1998-01-27 |