KU

Kazuaki Utsumi

NE Nec: 25 patents #354 of 14,502Top 3%
TO Toyota: 5 patents #5,641 of 26,838Top 25%
NC Nippon Electric Co.: 4 patents #30 of 792Top 4%
TC Tokyo Ohka Kogyo Co.: 2 patents #345 of 684Top 55%
WU Waseda University: 1 patents #116 of 411Top 30%
Overall (All Time): #102,896 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #TitleCo-InventorsDate
11121386 Temperature estimating apparatus Yasumasa OGUMA, Tetsuya Osaka, Shingo Tsuda, Tokihiko Yokoshima, Daikichi MUKOYAMA 2021-09-14
10718817 Battery state estimating apparatus Yasumasa OGUMA, Tetsuya Osaka, Shingo Tsuda, Tokihiko Yokoshima, Daikichi MUKOYAMA 2020-07-21
10656216 Battery state estimating apparatus Yasumasa OGUMA, Tetsuya Osaka, Tokihiko Yokoshima, Shingo Tsuda, Daikichi MUKOYAMA 2020-05-19
10649036 Battery state estimating apparatus Yasumasa OGUMA, Tetsuya Osaka, Tokihiko Yokoshima, Shingo Tsuda, Daikichi MUKOYAMA 2020-05-12
10507734 Battery state estimating apparatus Yasumasa OGUMA, Tetsuya Osaka, Shingo Tsuda, Tokihiko Yokoshima, Daikichi MUKOYAMA 2019-12-17
9780593 Electric cells for battery pack, battery control system, and battery control method Keiji Katayama 2017-10-03
9653715 Packaged battery, stacked battery assembly, and film-covered battery Masatomo Mizuta, Makihiro Otohata, Hiroshi Yageta 2017-05-16
8722241 Packaged battery, stacked battery assembly, and film-covered battery Masatomo Mizuta, Makihiro Otohata, Hiroshi Yageta 2014-05-13
8692506 Charging apparatus and charging/discharging apparatus including temperature adjusting element of secondary battery for buffering Takashi Saito 2014-04-08
8228040 Electric cells for battery pack, battery control system, and battery control method Keiji Katayama 2012-07-24
6188127 Semiconductor packing stack module and method of producing the same Naoji Senba, Yuzo Shimada, Kenichi Tokuno, Ikushi Morizaki, Akihiro Dohya +1 more 2001-02-13
6130111 Packaged semiconductor device and method of manufacturing the same Kazuhiro Ikuina, Yuzo Shimada 2000-10-10
6091310 Multi-layer printed board with an inductor providing a high impedance at high frequency Shiro Yoshida, Mitsuo Saitou 2000-07-18
5952712 Packaged semiconductor device and method of manufacturing the same Kazuhiro Ikuina, Yuzo Shimada 1999-09-14
5830563 Interconnection structures and method of making same Tadanori Shimoto, Yoshitsugu Funada, Koji Matsui, Yuzo Shimada 1998-11-03
5545281 Method of bonding circuit boards Koji Matsui, Mitsuru Kimura, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama 1996-08-13
5318651 Method of bonding circuit boards Koji Matsui, Mitsuru Kimura, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama 1994-06-07
5262369 Dielectric ceramic compositions Toru Mori, Atsushi Ochi, Tetsuo Yoshimoto, Souichiro Sugano, Shinji Abe 1993-11-16
5079199 Method of manufacturing dielectric ceramic compositions of lead-based perovskite Atsushi Ochi, Seiji Takahashi, Masato Shirakata 1992-01-07
4791078 Ceramic composition with improved electrical and mechanical properties Susumu Saito, Masatomo Yonezawa 1988-12-13
4783358 Ceramic wiring substrate Teruyuki Ikeda 1988-11-08
4766671 Method of manufacturing ceramic electronic device Hideo Takamizawa, Mitsuo Tsuzuki, Michihisa Suga, Sadayuki Takahashi 1988-08-30
4756808 Piezoelectric transducer and process for preparation thereof Takeshi Inoue, Sadayuki Takahashi 1988-07-12
4757235 Electroluminescent device with monolithic substrate Keiji Nunomura, Yoshio Sano 1988-07-12
4724283 Multi-layer circuit board having a large heat dissipation Yuzo Shimada, Yasuhiro Kurokawa 1988-02-09