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High frequency circuit substrate and method for forming the same |
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2005-06-07 |
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RF package with multi-layer substrate having coplanar feed through and connection interface |
Masaharu Ito, Kenichi Maruhashi, Keiichi Ohata |
2004-08-10 |
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Method of manufacturing an ink jet recording head |
Torahiko Kanda, Yasuhiro Otsuka, Takaharu Kondo, Katsuhiro Notsu |
2002-10-22 |
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Low-temperature calcined glass ceramic and a manufacturing process therefor |
Ichiro Hazeyama |
2002-02-19 |
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Packaged semiconductor device and method of manufacturing the same |
Yuzo Shimada, Kazuaki Utsumi |
2000-10-10 |
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Multilayer glass ceramic substrate and process for producing the same |
Yuzo Shimada |
1999-11-23 |
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Packaged semiconductor device and method of manufacturing the same |
Yuzo Shimada, Kazuaki Utsumi |
1999-09-14 |
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Glass-ceramic substrate and method of producing the same |
Hiroyuki Gotoh |
1999-09-07 |
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Low temperature firing glass-ceramic substrate and production process thereof |
Ichiro Hazeyama |
1999-05-11 |
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Ceramic substrate for semiconductor device |
Mitsuru Kimura |
1998-05-26 |
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Multilayer glass ceramic substrate and process for producing the same |
Yuzo Shimada |
1998-05-19 |
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Multi-layer wiring substrate, and process for producing the same |
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1998-03-17 |
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Process for producing a silica sintered product for a multi-layer wiring substrate |
Ichiro Hazeyama, Mitsuru Kimura |
1998-02-03 |
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Mutlilayer glass ceramic substrate and method of fabricating the same |
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1996-04-09 |