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Winding method and structure for stator coils |
Shigeru Nishida |
2004-06-08 |
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Ceramic substrate for semiconductor device |
Kazuhiro Ikuina |
1998-05-26 |
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Multi-layer wiring substrate, and process for producing the same |
Ichiro Hazeyama, Kazuhiro Ikuina |
1998-03-17 |
| 5714112 |
Process for producing a silica sintered product for a multi-layer wiring substrate |
Ichiro Hazeyama, Kazuhiro Ikuina |
1998-02-03 |
| 5576518 |
Via-structure of a multilayer interconnection ceramic substrate |
Akinobu Shibuya |
1996-11-19 |
| 5545281 |
Method of bonding circuit boards |
Koji Matsui, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama |
1996-08-13 |
| 5506058 |
Mutlilayer glass ceramic substrate and method of fabricating the same |
Kazuhiro Ikuina |
1996-04-09 |
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Element joining pad for semiconductor device mounting board |
Akinobu Shibuya |
1996-01-16 |
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Method of bonding circuit boards |
Koji Matsui, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama |
1994-06-07 |
| 4874721 |
Method of manufacturing a multichip package with increased adhesive strength |
Shoji Nakakita |
1989-10-17 |
| 4594473 |
Substrate having at least one fine-wired conductive layer |
Tatsuo Inoue |
1986-06-10 |