Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746490 | Winding method and structure for stator coils | Shigeru Nishida | 2004-06-08 |
| 5757062 | Ceramic substrate for semiconductor device | Kazuhiro Ikuina | 1998-05-26 |
| 5728470 | Multi-layer wiring substrate, and process for producing the same | Ichiro Hazeyama, Kazuhiro Ikuina | 1998-03-17 |
| 5714112 | Process for producing a silica sintered product for a multi-layer wiring substrate | Ichiro Hazeyama, Kazuhiro Ikuina | 1998-02-03 |
| 5576518 | Via-structure of a multilayer interconnection ceramic substrate | Akinobu Shibuya | 1996-11-19 |
| 5545281 | Method of bonding circuit boards | Koji Matsui, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama | 1996-08-13 |
| 5506058 | Mutlilayer glass ceramic substrate and method of fabricating the same | Kazuhiro Ikuina | 1996-04-09 |
| 5485352 | Element joining pad for semiconductor device mounting board | Akinobu Shibuya | 1996-01-16 |
| 5318651 | Method of bonding circuit boards | Koji Matsui, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama | 1994-06-07 |
| 4874721 | Method of manufacturing a multichip package with increased adhesive strength | Shoji Nakakita | 1989-10-17 |
| 4594473 | Substrate having at least one fine-wired conductive layer | Tatsuo Inoue | 1986-06-10 |