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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
MK

Mitsuru Kimura — 11 Patents

Nec: 10 patents #1,350 of 14,502Top 10%
TCTokyo Ohka Kogyo Co.: 2 patents #345 of 684Top 55%
TCTamagawa Seiki Co.: 1 patents #41 of 88Top 50%
Tokyo, JP: #14,217 of 90,295 inventorsTop 20%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Mitsuru Kimura has been granted 11 US patents while listed as an inventor at Nec. The first was granted in 1986 and the most recent in June 2004. Mitsuru Kimura ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Mitsuru Kimura in Tokyo, JP.

Patents per Year

Patents granted per year, 1986 to 2004Bar chart with a peak of 4 patents in 1996.peak 41986: 1 patents19861989: 1 patents19891994: 1 patents19941996: 4 patents19961998: 3 patents19982004: 1 patents2004

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
6746490 Winding method and structure for stator coils Shigeru Nishida 2004-06-08
5757062 Ceramic substrate for semiconductor device Kazuhiro Ikuina 1998-05-26 $9,000
5728470 Multi-layer wiring substrate, and process for producing the same Ichiro Hazeyama, Kazuhiro Ikuina 1998-03-17 $25,000
5714112 Process for producing a silica sintered product for a multi-layer wiring substrate Ichiro Hazeyama, Kazuhiro Ikuina 1998-02-03 $21,000
5576518 Via-structure of a multilayer interconnection ceramic substrate Akinobu Shibuya 1996-11-19 $20,000
5545281 Method of bonding circuit boards Koji Matsui, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama 1996-08-13 $20,000
5506058 Mutlilayer glass ceramic substrate and method of fabricating the same Kazuhiro Ikuina 1996-04-09 $16,000
5485352 Element joining pad for semiconductor device mounting board Akinobu Shibuya 1996-01-16 $27,000
5318651 Method of bonding circuit boards Koji Matsui, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama 1994-06-07 $29,000
4874721 Method of manufacturing a multichip package with increased adhesive strength Shoji Nakakita 1989-10-17 $24,000
4594473 Substrate having at least one fine-wired conductive layer Tatsuo Inoue 1986-06-10 $238,000