Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4874721 | Method of manufacturing a multichip package with increased adhesive strength | Mitsuru Kimura | 1989-10-17 |
| 4569876 | Multi-layered substrate having a fine wiring structure for LSI or VLSI circuits | — | 1986-02-11 |