Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6798070 | Electronic device assembly and a method of connecting electronic devices constituting the same | Takuo Funaya, Tadanori Shimoto, Koji Matsui | 2004-09-28 |
| 6625883 | Method for making a bump structure | Koji Soejima | 2003-09-30 |
| 6576499 | Electronic device assembly and a method of connecting electronic devices constituting the same | Takuo Funaya, Tadanori Shimoto, Koji Matsui | 2003-06-10 |
| 6486540 | Three-dimensional semiconductor device and method of manufacturing the same | Takao Yamazaki, Yuzo Shimada | 2002-11-26 |
| 6422452 | Method and apparatus for lining up micro-balls | Takumi Yamamoto, Kazuhiko Futakami, Akira Hatase, Nobuaki Takahashi, Yuzo Shimada | 2002-07-23 |
| 6378756 | Solder ball arrangement device | Nobuaki Takahashi, Yuzo Shimada | 2002-04-30 |
| 6313533 | Function element, substrate for mounting function element thereon, and method of connecting them to each other | Takuo Funaya, Kouji Matsui | 2001-11-06 |
| 6307159 | Bump structure and method for making the same | Koji Soejima | 2001-10-23 |
| 6307392 | Probe card and method of forming a probe card | Koji Soejima | 2001-10-23 |
| 6194787 | Multistage coupling semiconductor carrier, semiconductor device using the semiconductor carrier | Kazuyuki Mikubo | 2001-02-27 |
| 6191482 | Semiconductor chip carrier having partially buried conductive pattern and semiconductor device using the same | Nobuaki Takahashi | 2001-02-20 |
| 6188127 | Semiconductor packing stack module and method of producing the same | Yuzo Shimada, Kazuaki Utsumi, Kenichi Tokuno, Ikushi Morizaki, Akihiro Dohya +1 more | 2001-02-13 |
| 6114864 | Probe card with plural probe tips on a unitary flexible tongue | Koji Soejima | 2000-09-05 |
| 6096259 | Fabrication method of plastic-molded lead component | Nobuaki Takahashi, Koji Soejima, Yuzo Shimada | 2000-08-01 |
| 6095398 | Solder ball arrangement device | Nobuaki Takahashi, Yuzo Shimada | 2000-08-01 |
| 5976965 | Method for arranging minute metallic balls | Nobuaki Takahashi, Yuzo Shimada | 1999-11-02 |
| 5973392 | Stacked carrier three-dimensional memory module and semiconductor device using the same | Yuzo Shimada, Ikusi Morizaki, Hideki Kusamitu, Makoto Ohtsuka, Katsumasa Hashimoto | 1999-10-26 |
| 5936845 | IC package and IC probe card with organic substrate | Koji Soejima, Nobuaki Takahashi, Yuzo Shimada | 1999-08-10 |
| 5883426 | Stack module | Kenichi Tokuno, Ikushi Morisaki, Akihiro Doya, Manabu Bonkohara, Yuuzou Shimada +1 more | 1999-03-16 |
| 5793117 | Semiconductor device and method of fabricating the same | Yuzo Shimada, Nobuaki Takahashi | 1998-08-11 |
| 5600180 | Sealing structure for bumps on a semiconductor integrated circuit chip | Teruo Kusaka, Atsushi Nishizawa, Nobuaki Takahashi | 1997-02-04 |
| 5310965 | Multi-level wiring structure having an organic interlayer insulating film | Atsushi Nishizawa | 1994-05-10 |