Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9386685 | Interposer and semiconductor module using the same | — | 2016-07-05 |
| 9282638 | Electrode, electrode material, and electrode formation method | Hirofumi Nakamura, Qiwei He | 2016-03-08 |
| 8907459 | Three-dimensional semiconductor integrated circuit device and method of fabricating the same | — | 2014-12-09 |
| 8300143 | Solid-state imaging device, method of fabricating the same, and camera module | — | 2012-10-30 |
| 6188127 | Semiconductor packing stack module and method of producing the same | Naoji Senba, Yuzo Shimada, Kazuaki Utsumi, Kenichi Tokuno, Ikushi Morizaki +1 more | 2001-02-13 |
| 5892271 | Semiconductor device | Hidetoshi Takeda | 1999-04-06 |
| 5883426 | Stack module | Kenichi Tokuno, Ikushi Morisaki, Akihiro Doya, Naoji Senba, Yuuzou Shimada +1 more | 1999-03-16 |
| 5834338 | Chip carrier semiconductor device assembly and a method for forming the same | Hidetoshi Takeda | 1998-11-10 |
| 5805422 | Semiconductor package with flexible board and method of fabricating the same | Kenichi Otake | 1998-09-08 |
| 5763295 | Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics | Kenichi Tokuno | 1998-06-09 |
| 5686763 | Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics | Kenichi Tokuno | 1997-11-11 |
| 5602419 | Chip carrier semiconductor device assembly | Hidetoshi Takeda | 1997-02-11 |
| 5570274 | High density multichip module packaging structure | Masaru Saito | 1996-10-29 |
| 5063435 | Semiconductor device | Satoru Okamoto, Kazufumi Terazi, Seiichi Nishino | 1991-11-05 |
| 4763409 | Method of manufacturing semiconductor device | Kouichi Takekawa | 1988-08-16 |
| 4714952 | Capacitor built-in integrated circuit packaged unit and process of fabrication thereof | Kouichi Takekawa | 1987-12-22 |