Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6543669 | Bonding apparatus and bonding tool for component | Seiji Takahashi, Takatoshi Ishikawa, Makoto Okazaki | 2003-04-08 |
| 6497354 | Bonding apparatus and bonding tool for component | Seiji Takahashi, Takatoshi Ishikawa, Makoto Okazaki | 2002-12-24 |
| 6078123 | Structure and method for mounting a saw device | Kei Tanaka, Eiichi Fukiharu, Yasunori Tanaka, Michinobu Tanioka, Takuo Funaya | 2000-06-20 |
| 5839187 | Apparatus and method for mounting a chip | Seiichi Sato | 1998-11-24 |
| 5805422 | Semiconductor package with flexible board and method of fabricating the same | Manabu Bonkohara | 1998-09-08 |