Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767761 | Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin | — | 2004-07-27 |
| 6734566 | Recyclable flip-chip semiconductor device | — | 2004-05-11 |
| 6723627 | Method for manufacturing semiconductor devices | Syuuichi Kariyazaki | 2004-04-20 |
| 6696317 | Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin | — | 2004-02-24 |
| 6696764 | Flip chip type semiconductor device and method of manufacturing the same | — | 2004-02-24 |
| 6611063 | Resin-encapsulated semiconductor device | Michihiko Ichinose, Tomoko Takizawa, Keiichirou Kata | 2003-08-26 |
| 6445062 | Semiconductor device having a flip chip cavity with lower stress and method for forming same | — | 2002-09-03 |
| 6406942 | Flip chip type semiconductor device and method for manufacturing the same | — | 2002-06-18 |
| 5704593 | Film carrier tape for semiconductor package and semiconductor device employing the same | — | 1998-01-06 |