Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6611063 | Resin-encapsulated semiconductor device | Michihiko Ichinose, Hirokazu Honda, Keiichirou Kata | 2003-08-26 |
| 6504244 | Semiconductor device and semiconductor module using the same | Michihiko Ichinose | 2003-01-07 |
| 6486553 | Semiconductor device with increased connection strength between solder balls and wiring layer | Masanori Takeuchi | 2002-11-26 |