Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256196 | Semiconductor device and method for manufacturing same | Michiaki Tamakawa, Toshihiro Iwasaki | 2019-04-09 |
| 9685376 | Semiconductor device and method of manufacturing semiconductor device | Yoshihiko Ikemoto, Hiroshi Inoue, Hiroaki Matsubara, Yukari Imaizumi | 2017-06-20 |
| 9635762 | Semiconductor package | Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Hiroshi Demachi, Takeshi Miyakoshi +8 more | 2017-04-25 |
| 9553052 | Magnetic shielding package of non-volatile magnetic memory element | Hiroaki Matsubara, Toshihiro Iwasaki, Tomoshige Chikai, Shinji Watanabe, Michiaki Tamakawa | 2017-01-24 |
| 9368474 | Manufacturing method for semiconductor device | Hiroaki Matsubara, Tomoshige Chikai, Takashi Nakamura, Hirokazu Honda, Hiroshi Demachi +8 more | 2016-06-14 |
| 9362200 | Heat sink in the aperture of substrate | Hirokazu Honda, Shinji Watanabe, Toshihiro Iwasaki, Koichiro Niwa, Takeshi Miyakoshi +6 more | 2016-06-07 |
| 8367939 | Interconnect substrate, method of manufacturing interconnect substrate and semiconductor device | — | 2013-02-05 |
| 8174117 | Semiconductor device and method of manufacturing the same | — | 2012-05-08 |
| 6791675 | Optical waveguide path, manufacturing method and coupling method of the same, and optical waveguide path coupling structure | Hideo Kikuchi | 2004-09-14 |
| 5746813 | Surface protection material for printed circuit board and process of forming surface protection films | Masahiro Yamaguchi | 1998-05-05 |
| 5658611 | Surface protection material for printed circuit board and process of forming surface protection films | Masahiro Yamaguchi | 1997-08-19 |
| 5464725 | Method of manufacturing a printed wiring board | Masahiro Yamaguchi | 1995-11-07 |
| 5458907 | Method of manufacturing printed circuit boards having an oxidation proof coating on a copper or copper alloy circuit pattern | — | 1995-10-17 |
| 5324535 | Process of coating printed wiring board with solid solder resist pattern formed from liquid and dry solder resist films | — | 1994-06-28 |
| 5258094 | Method for producing multilayer printed wiring boards | Seiji Furui, Ryo Maniwa, Keisuke Okada | 1993-11-02 |