Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217670 | Semiconductor device having a back electrode including Au-Sb alloy layer and method of manufacturing the same | Yuji Takahashi, Masaki Watanabe, Kentaro Yamada, Masaki Sakashita, Shinichi Maeda +1 more | 2022-01-04 |
| 10199338 | Semiconductor device and a method of manufacturing the same | Taku Kanaoka, Yoshio Fukayama, Yutaro Ebata, Kazuhisa Higuchi, Koji Fujishima | 2019-02-05 |
| 8669659 | Semiconductor device and a method of manufacturing the same | Taku Kanaoka, Yoshio Fukayama, Yutaro Ebata, Kazuhisa Higuchi, Koji Fujishima | 2014-03-11 |
| 8183691 | Semiconductor device with pads overlapping wiring layers including dummy wiring | Taku Kanaoka, Yoshio Fukayama, Yutaro Ebata, Kazuhisa Higuchi, Koji Fujishima | 2012-05-22 |
| 7759804 | Semiconductor device and a method of manufacturing the same | Taku Kanaoka, Yoshio Fukayama, Yutaro Ebata, Kazuhisa Higuchi, Koji Fujishima | 2010-07-20 |
| 7750427 | Semiconductor device and a method of manufacturing the same | Kozo Watanabe, Shoji Yoshida, Shinichi Tanabe, Takashi Hashimoto | 2010-07-06 |
| 7705462 | Semiconductor device and a method of manufacturing the same | Ken Uchikoshi, Naokatsu Suwanai, Atsushi Tachigami, Katsuhiko Hotta, Kazuhiko Sato | 2010-04-27 |
| 7615848 | Semiconductor device and a method of manufacturing the same | Ken Uchikoshi, Naokatsu Suwanai, Atsushi Tachigami, Katsuhiko Hotta, Kazuhiko Sato | 2009-11-10 |
| 7504297 | Semiconductor device and a method of manufacturing the same | Kozo Watanabe, Shoji Yoshida, Shinichi Tanabe, Takashi Hashimoto | 2009-03-17 |
| 7400046 | Semiconductor device with guard rings that are formed in each of the plural wiring layers | Ken Uchikoshi, Naokatsu Suwanai, Atsushi Tachigami, Katsuhiko Hotta, Kazuhiko Sato | 2008-07-15 |
| 7342302 | Semiconductor device and a method of manufacturing the same | Taku Kanaoka, Yoshio Fukayama, Yutaro Ebata, Kazuhisa Higuchi, Koji Fujishima | 2008-03-11 |
| 7303986 | Semiconductor device and a method of manufacturing the same | Ken Uchikoshi, Naokatsu Suwanai, Atsushi Tachigami, Katsuhiko Hotta, Kazuhiko Sato | 2007-12-04 |
| 7241685 | Semiconductor device and method of manufacturing the same | Hiroshi Moriya, Tomio Iwasaki, Hideo Miura, Shinji Nishihara | 2007-07-10 |
| 7189637 | Method of manufacturing a semiconductor device having a multi-layered wiring structure | Ken Uchikoshi, Naokatsu Suwanai, Atsushi Tachigami, Katsuhiko Hotta, Kazuhiko Sato | 2007-03-13 |
| 7132341 | Semiconductor integrated circuit device and the process of the same | Fumiaki Endo, Masanori Kojima, Katsuhiro Uchimura, Hideaki Kanazawa, Masakazu Sugiura | 2006-11-07 |
| 7102223 | Semiconductor device and a method of manufacturing the same | Taku Kanaoka, Yoshio Fukayama, Yutaro Ebata, Kazuhisa Higuchi, Koji Fujishima | 2006-09-05 |
| 7064437 | Semiconductor device having aluminum conductors | Tomio Iwasaki, Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara | 2006-06-20 |
| 6897570 | Semiconductor device and method of manufacturing same | Takashi Nakajima, Naotaka Tanaka, Yasuyuki Nakajima, Ryo Haruta, Tomoo Matsuzawa +1 more | 2005-05-24 |
| 6856021 | Semiconductor device having aluminum alloy conductors | Tomio Iwasaki, Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara | 2005-02-15 |
| 6784549 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Tomio Iwasaki, Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara | 2004-08-31 |
| 6780757 | Semiconductor integrated circuit device and method for making the same | Masayuki Suzuki, Shinji Nishihara, Shinichi Ishida, Hiromi Abe, Sonoko Tohda +3 more | 2004-08-24 |
| 6617691 | Semiconductor device | Takashi Nakajima, Tomio Iwasaki, Hiroyuki Ohta, Hideo Miura, Shinji Nishihara +2 more | 2003-09-09 |
| 6583049 | Semiconductor integrated circuit device and method for making the same | Masayuki Suzuki, Shinji Nishihara, Shinichi Ishida, Hiromi Abe, Sonoko Tohda +3 more | 2003-06-24 |
| 6548904 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Tomio Iwasaki, Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Shinji Nishihara | 2003-04-15 |
| 6545362 | Semiconductor device and method of manufacturing the same | Hiroshi Moriya, Tomio Iwasaki, Hideo Miura, Shinji Nishihara | 2003-04-08 |