Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847614 | Semiconductor device having a stacked electrode with an electroless nickel plating layer | Tomoyasu Furukawa, Toshiaki Morita, Daisuke Kawase | 2020-11-24 |
| 7982266 | Dielectric material separated-type, high breakdown voltage semiconductor circuit device, and production method thereof | Atsuo Watanabe, Mitsutoshi Honda, Norio Ishitsuka, Masahiro Ito, Shinichi Kurita +1 more | 2011-07-19 |