Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131970 | Liquid resin composition for sealing and electronic component apparatus | Hidetoshi Inoue, Hisato Takahashi, Tsuyoshi KAMIMURA, Haruyuki Yoshii | 2024-10-29 |
| D804435 | Flap in an adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2017-12-05 |
| 9190309 | Tape for processing wafer, method for manufacturing tape for processing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2015-11-17 |
| 9076832 | Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2015-07-07 |
| 9076833 | Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2015-07-07 |
| 8975161 | Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method | Rie Katou, Shinya Katou, Ryoji Furutani, Tatsuya Sakuta, Kouji Komorida | 2015-03-10 |
| D690278 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2013-09-24 |
| D689831 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2013-09-17 |
| 8470115 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Ryoji Furutani, Michio Mashino, Teiichi Inada | 2013-06-25 |
| 8465615 | Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device | Maiko Tanaka, Michio Uruno, Ryoji Furutani, Michio Mashino, Teiichi Inada | 2013-06-18 |
| D680505 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2013-04-23 |
| D664511 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-07-31 |
| D664512 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-07-31 |
| D656910 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-04-03 |
| D656909 | Adhesive tape for semiconductor manufacturing | Kouhei Taniguchi, Shinya Katou, Kouji Komorida, Michio Mashino, Tatsuya Sakuta +1 more | 2012-04-03 |
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2012-02-21 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2011-05-24 |
| 7538965 | Method and apparatus for writing servo management information in a disk drive | Katsuki Ueda, Yuichi Notake, Masahide Yatsu, Hideo Sado, Seiji Mizukoshi +1 more | 2009-05-26 |
| 7517724 | Dicing/die bonding sheet | Keiichi Hatakeyama, Michio Uruno, Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata | 2009-04-14 |
| 7457074 | Method and apparatus for correcting errors while writing spiral servo information in a disk drive | Hideo Sado, Masahide Yatsu, Yuichi Notake, Seiji Mizukoshi, Takuji Shimada | 2008-11-25 |
| 7070670 | Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device | Takeo Tomiyama, Teiichi Inada, Masaaki Yasuda, Keiichi Hatakeyama, Yuuji Hasegawa +8 more | 2006-07-04 |