Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131970 | Liquid resin composition for sealing and electronic component apparatus | Hidetoshi Inoue, Takayuki Matsuzaki, Hisato Takahashi, Tsuyoshi KAMIMURA | 2024-10-29 |
| 10941280 | Liquid sealing material for copper bump, and resin composition for use as same | Tomoya YAMAZAWA | 2021-03-09 |
| 9805998 | Liquid sealing material and electronic component using same | Seiichi Ishikawa, Kazuyuki Kohara | 2017-10-31 |
| 9748158 | Liquid sealing material and electronic component using same | Seiichi Ishikawa, Kazuyuki Kohara | 2017-08-29 |
| 8586467 | Method of mounting electronic component and mounting substrate | Osamu Suzuki, Seiichi Ishikawa | 2013-11-19 |
| 6841415 | Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate | Osamu Suzuki, Kenichi Suzuki | 2005-01-11 |
| 6498200 | Cationically polymerizable resin composition | Osamu Suzuki, Hisao Kondo, Kenichi Suzuki | 2002-12-24 |