Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10941280 | Liquid sealing material for copper bump, and resin composition for use as same | Haruyuki Yoshii | 2021-03-09 |
| 10196513 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe | 2019-02-05 |
| 9947604 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe | 2018-04-17 |