Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10196513 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kodai Okoshi, Nobuyuki Abe | 2019-02-05 |
| 9947604 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kodai Okoshi, Nobuyuki Abe | 2018-04-17 |
| 9805998 | Liquid sealing material and electronic component using same | Seiichi Ishikawa, Haruyuki Yoshii | 2017-10-31 |
| 9748158 | Liquid sealing material and electronic component using same | Seiichi Ishikawa, Haruyuki Yoshii | 2017-08-29 |
| 9204496 | Planar heating element and manufacturing method for same | Masaki Hanada, Yukio Abe, Koji Yoshimoto, Takahito Ishii | 2015-12-01 |
| 8367987 | Flexible PTC heating element and method of manufacturing the heating element | Takahito Ishii, Keiko Yasui, Seishi Terakado, Mitsuru Yoneyama | 2013-02-05 |
| 7675004 | Heating element and production method thereof | Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka +1 more | 2010-03-09 |
| 7366578 | Method, program and system for designing shape of product, such as a tire | Takuya Yamamoto, Masatoshi Tanaka | 2008-04-29 |
| 7049559 | Flexible PTC heating element and method of manufacturing the heating element | Takahito Ishii, Keiko Yasui, Seishi Terakado, Mitsuru Yoneyama | 2006-05-23 |
| 6198377 | Plastic thermistor and thermosensitive device comprising the same | Tadataka Yamazaki, Masahiko Ito | 2001-03-06 |