Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10196513 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Tomoya YAMAZAWA, Kazuyuki Kohara, Nobuyuki Abe | 2019-02-05 |
| 9947604 | Epoxy resin composition, semiconductor sealing agent, and semiconductor device | Kazuyuki Kohara, Tomoya YAMAZAWA, Nobuyuki Abe | 2018-04-17 |