Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11905412 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Takahiro Taki, Takako Ejiri, Kana Uchimura, Toshiki Fujii, Yukako Omori +2 more | 2024-02-20 |
| 8017444 | Adhesive sheet, semiconductor device, and process for producing semiconductor device | Teiichi Inada, Michio Mashino, Michio Uruno | 2011-09-13 |