Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11905412 | Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor package | Takahiro Taki, Tetsuro Iwakura, Kana Uchimura, Toshiki Fujii, Yukako Omori +2 more | 2024-02-20 |
| 8956732 | Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board | Masaki Takeuchi, Katsuyuki Masuda, Kenichi Tomioka | 2015-02-17 |
| 8236906 | Polyamide-imide resin, process for production of polyamide resin, and curable resin composition | Katsuyuki Masuda | 2012-08-07 |
| 7740936 | Adhesion assisting agent fitted metal foil, and printed wiring board using thereof | Nobuyuki Ogawa, Hitoshi Onozeki, Takahiro Tanabe, Kenji Takai, Norio Moriike +2 more | 2010-06-22 |