Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12258468 | Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package | Yuya HIRAYAMA, Keisuke Kushida, Hiroshi Shimizu | 2025-03-25 |
| 11691389 | Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition | Yuya HIRAYAMA, Takayo KITAJIMA, Keisuke Kushida, Minoru Kakitani, Hiroshi Shimizu | 2023-07-04 |
| 8956732 | Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board | Masaki Takeuchi, Katsuyuki Masuda, Takako Ejiri | 2015-02-17 |
| 8501279 | Flexible laminate board, process for manufacturing of the board, and flexible print wiring board | Masahiko Suzuki, Kazuhito Obata, Katsuyuki Masuda, Masaki Takeuchi, Sumio Yoshida +2 more | 2013-08-06 |
| 7208539 | Thermosetting resin composition, and prepreg and laminated board using the same | Shinji Tsuchikawa, Michitoshi Arata, Kazuhito Kobayashi | 2007-04-24 |
| 7157506 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate | Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano | 2007-01-02 |
| 6462147 | Epoxy resin compositions for printed circuit board and printed circuit board using the same | Michitoshi Arata, Nozomu Takano, Tomio Fukuda | 2002-10-08 |