Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12264224 | Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package | Aya Kasahara, Tomohiko KOTAKE | 2025-04-01 |
| 12256490 | Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package | Mari SHIMIZU, Yasuo Kamigata, Tomohiko KOTAKE, Shin Takanezawa, Akira Shimizu +3 more | 2025-03-18 |
| 11795293 | Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device | Kazuya KIGUCHI, Tomoo NISHIYAMA, Norihiko Sakamoto | 2023-10-24 |
| 11049825 | Method for producing semiconductor device | Aya Kasahara, Toshihisa Nonaka, Naoya Suzuki | 2021-06-29 |
| 10776484 | On-chip monitor circuit and semiconductor chip | Makoto Nagata, Jean-Luc Danger, Shivam Bhasin | 2020-09-15 |
| 10464502 | Roof ditch molding end cap | Jordan Renn, Jeffrey Tessmer, Scott Nydam, Hironori Awano, Kiyoshi Sagara | 2019-11-05 |
| 10034384 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Kazuhiko Kurafuchi, Kunpei Yamada, Toshimasa Nagoshi | 2018-07-24 |
| 9873771 | Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device | Yutaka Nomura, Yusuke WATASE, Hirokuni Ogihara, Norihiko Sakamoto, Hikari Murai | 2018-01-23 |
| 9661763 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Kazuhiko Kurafuchi, Kunpei Yamada, Toshimasa Nagoshi | 2017-05-23 |
| 8568891 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Yasuyuki Mizuno, Kazutoshi Danjobara, Hikari Murai | 2013-10-29 |
| 8501870 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Yasuyuki Mizuno, Kazutoshi Danjobara, Hikari Murai | 2013-08-06 |
| 8404769 | Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate | Yasuyuki Mizuno, Kazutoshi Danjoubara, Hikari Murai | 2013-03-26 |
| 8277948 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Yasuyuki Mizuno, Kazutoshi Danjobara, Hikari Murai | 2012-10-02 |
| 7816430 | Composition of polycyanate ester and biphenyl epoxy resin | Yasuyuki Mizuno, Hiroshi Shimizu, Kazuhito Kobayashi, Takayuki Sueyoshi | 2010-10-19 |
| 7157506 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate | Yasuyuki Mizuno, Kenichi Tomioka, Nozomu Takano | 2007-01-02 |
| 7078106 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Yasuyuki Mizuno, Nozomu Takano | 2006-07-18 |
| 6667107 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Yasuyuki Mizuno, Nozomu Takano | 2003-12-23 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe +6 more | 2001-03-06 |
| 5879568 | Process for producing multilayer printed circuit board for wire bonding | Naoyuki Urasaki, Kouichi Tsuyama, Kazuhito Kobayashi, Norio Okano, Hiroshi Shimizu +6 more | 1999-03-09 |