Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10251265 | Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Akiko Kawaguchi, Yasuyuki Mizuno, Kazumasa Takeuchi, Shigeru Haeno, Yoshinori Nagai +1 more | 2019-04-02 |
| 9656353 | Reflow film, solder bump formation method, solder joint formation method, and semiconductor device | Kazuhiro Miyauchi, Naoya Suzuki, Yukihiko Yamashita | 2017-05-23 |
| 8664534 | Printed wiring board | Kazumasa Takeuchi, Masaki Yamaguchi, Makoto Yanagida | 2014-03-04 |
| 8440285 | Composite, prepreg, laminated plate clad with metal foil, material for connecting circuit board, and multilayer printed wiring board and method for manufacture thereof | Masaki Kamiya | 2013-05-14 |
| 7947332 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board | Kazumasa Takeuchi, Katsuyuki Masuda, Masashi Tanaka, Kazuhito Obata, Yuuji Ooyama +1 more | 2011-05-24 |
| 7736749 | Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board | Hideo Baba, Kazuhiro Miyauchi | 2010-06-15 |
| 7166361 | Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board | Hideo Baba, Kazuhiro Miyauchi | 2007-01-23 |
| 7157506 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate | Yasuyuki Mizuno, Daisuke Fujimoto, Kenichi Tomioka | 2007-01-02 |
| 7078106 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Yasuyuki Mizuno, Daisuke Fujimoto | 2006-07-18 |
| 6787614 | Thermosetting resin composition and process for producing the same | Kazuhiro Miyauchi, Hideo Baba | 2004-09-07 |
| 6706409 | Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board | Tomio Fukuda, Masato Miyatake | 2004-03-16 |
| 6696155 | Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances | Shigeo Sase, Tomio Fukuda, Michitoshi Arata | 2004-02-24 |
| 6692792 | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances | Shigeo Sase, Tomio Fukuda, Michitoshi Arata | 2004-02-17 |
| 6667107 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Yasuyuki Mizuno, Daisuke Fujimoto | 2003-12-23 |
| 6572968 | Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards | Shigeo Sase, Tomio Fukuda, Michitoshi Arata | 2003-06-03 |
| 6558797 | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same | Michitoshi Arata, Kazuhito Kobayashi | 2003-05-06 |
| 6524717 | Prepreg, metal-clad laminate, and printed circuit board obtained from these | Tomio Fukuda, Masato Miyatake, Masahisa Ose | 2003-02-25 |
| 6462147 | Epoxy resin compositions for printed circuit board and printed circuit board using the same | Michitoshi Arata, Tomio Fukuda, Kenichi Tomioka | 2002-10-08 |
| 6329474 | Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole | Michitoshi Arata, Shigeo Sase, Tomio Fukuda | 2001-12-11 |
| 6214468 | Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same | Michitoshi Arata, Hikari Murai, Yoshiyuki Takeda | 2001-04-10 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe +6 more | 2001-03-06 |
| 6180250 | Epoxy composition for printed circuit boards | Michitoshi Arata, Shigeo Sase, Tomio Fukuda | 2001-01-30 |
| 5391687 | Method of producing high molecular weight epoxy resin using an amide solvent | Katsuji Shibata, Kazuhito Kobayashi, Masami Arai, Ikuo Hoshi | 1995-02-21 |
| 5304399 | Method of producing epoxy resin film | Katsuji Shibata, Kazuhito Kobayashi, Masami Arai, Ikuo Hoshi | 1994-04-19 |
| 5225268 | Epoxy resin film and method of producing epoxy resin film | Katsuji Shibata, Kazuhito Kobayashi, Masami Arai, Ikuo Hoshi | 1993-07-06 |