Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11938688 | Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate | Noriaki Murakami, Ryoichi UCHIMURA, Kenichi Ohhashi | 2024-03-26 |
| 6524717 | Prepreg, metal-clad laminate, and printed circuit board obtained from these | Nozomu Takano, Tomio Fukuda, Masato Miyatake | 2003-02-25 |