Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11938688 | Laminate, printed wiring board, semiconductor package, and method for manufacturing laminate | Noriaki Murakami, Masahisa Ose, Kenichi Ohhashi | 2024-03-26 |
| 11497117 | Metal-clad laminate, printed wiring board and semiconductor package | Yuji TOSAKA, Takeshi Saitoh, Yukio Nakamura, Ryohta SASAKI, Hiroshi Shimizu | 2022-11-08 |
| 11040517 | Printed wiring board and semiconductor package | Takeshi Saitoh, Yukio Nakamura, Ryohta SASAKI, Junki Somekawa, Yuji TOSAKA +1 more | 2021-06-22 |