Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497117 | Metal-clad laminate, printed wiring board and semiconductor package | Yuji TOSAKA, Takeshi Saitoh, Yukio Nakamura, Hiroshi Shimizu, Ryoichi UCHIMURA | 2022-11-08 |
| 11446845 | Method for manufacturing FRP precursor and method for manufacturing FRP | Yukio Nakamura, Kazutoshi Danjoubara, Takeshi Saitoh, Shintaro Hashimoto | 2022-09-20 |
| 11040517 | Printed wiring board and semiconductor package | Takeshi Saitoh, Yukio Nakamura, Junki Somekawa, Yuji TOSAKA, Hiroshi Shimizu +1 more | 2021-06-22 |
| 10856423 | Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board | Yuji TOSAKA, Takeshi Saitoh, Yukio Nakamura, Hiroshi Shimizu | 2020-12-01 |