Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Yuki Nagai, Hikari Murai | 2022-06-14 |
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Tetsuroh Irino, Yuusuke Kondou, Etsuo Mizushima, Takao Tanigawa | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima +2 more | 2022-03-29 |
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Yasuyuki Mizuno, Takao Tanigawa, Hikari Murai | 2021-06-22 |
| 10957964 | Multilayer transmission line plate | Takao Tanigawa, Tetsurou Irino, Yuusuke Kondou, Etsuo Mizushima, Yuki Nagai | 2021-03-23 |
| 10876000 | Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module | Shunsuke TONOUCHI, Tomokazu Shimada, Kazutoshi Danjoubara, Minoru Kakitani | 2020-12-29 |
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Yuki Nagai, Hikari Murai | 2019-12-31 |
| 10506705 | Multilayer transmission line plate | Yuusuke Kondou, Etsuo Mizushima, Takao Tanigawa, Yuki Nagai, Tetsurou Irino | 2019-12-10 |
| 9828466 | Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same | Yasuyuki Mizuno, Takao Tanigawa, Yuki Nagai, Hikari Murai | 2017-11-28 |
| 6706409 | Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board | Nozomu Takano, Masato Miyatake | 2004-03-16 |
| 6696155 | Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances | Nozomu Takano, Shigeo Sase, Michitoshi Arata | 2004-02-24 |
| 6692792 | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances | Nozomu Takano, Shigeo Sase, Michitoshi Arata | 2004-02-17 |
| 6572968 | Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards | Nozomu Takano, Shigeo Sase, Michitoshi Arata | 2003-06-03 |
| 6524717 | Prepreg, metal-clad laminate, and printed circuit board obtained from these | Nozomu Takano, Masato Miyatake, Masahisa Ose | 2003-02-25 |
| 6462147 | Epoxy resin compositions for printed circuit board and printed circuit board using the same | Michitoshi Arata, Nozomu Takano, Kenichi Tomioka | 2002-10-08 |
| 6329474 | Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole | Michitoshi Arata, Shigeo Sase, Nozomu Takano | 2001-12-11 |
| 6180250 | Epoxy composition for printed circuit boards | Michitoshi Arata, Shigeo Sase, Nozomu Takano | 2001-01-30 |
| 5883699 | Method and apparatus for preparing photographic processing control tool | Yasuo Kuramitsu, Eiji Yamada, Takeo Komazaki | 1999-03-16 |
| 4707316 | Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer | Atsushi Fujioka, Yasuo Miyadera | 1987-11-17 |
| 4598115 | Polyamino-bis-maleimide prepolymer, method for manufacture thereof, and method for manufacture of laminate using said prepolymer | Atsushi Fujioka, Yasuo Miyadera | 1986-07-01 |
| 4526838 | Polyamino-bis-imide resin | Atsushi Fujioka, Yasuo Miyadera | 1985-07-02 |