Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10876000 | Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module | Shunsuke TONOUCHI, Kazutoshi Danjoubara, Tomio Fukuda, Minoru Kakitani | 2020-12-29 |
| 9944827 | CMP polishing solution and polishing method | Kouji Mishima, Takafumi Sakurada | 2018-04-17 |
| 9318346 | CMP polishing liquid and polishing method | Mamiko Kanamaru, Takashi Shinoda | 2016-04-19 |
| 8883031 | CMP polishing liquid and polishing method | Mamiko Kanamaru, Takashi Shinoda | 2014-11-11 |
| 8859420 | Structure and method of making interconnect element, and multilayer wiring board including the interconnect element | Kimitaka Endo, Norihito Masuda | 2014-10-14 |
| 7923828 | Structure and method of making interconnect element, and multilayer wiring board including the interconnect element | Kimitaka Endo, Norihito Masuda | 2011-04-12 |