Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Tetsuroh Irino, Yuusuke Kondou, Tomio Fukuda, Takao Tanigawa | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Tomio Fukuda +2 more | 2022-03-29 |
| 10957964 | Multilayer transmission line plate | Takao Tanigawa, Tetsurou Irino, Yuusuke Kondou, Tomio Fukuda, Yuki Nagai | 2021-03-23 |
| 10506705 | Multilayer transmission line plate | Yuusuke Kondou, Takao Tanigawa, Yuki Nagai, Tomio Fukuda, Tetsurou Irino | 2019-12-10 |
| 9397381 | Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate | Yuusuke Kondou, Yasushi Watanabe, Yasuyuki Mizuno | 2016-07-19 |
| 7592250 | Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device | Yasushi Shimada, Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi +4 more | 2009-09-22 |
| 7239013 | Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device | Yasushi Shimada, Yoshitaka Hirata, Hiroyuki Kuriya, Kazuhisa Otsuka, Masanori Yamaguchi +4 more | 2007-07-03 |