Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11072730 | Composition having excellent adhesiveness to polyolefins | Takako Hoshino, Masaya Umeyama | 2021-07-27 |
| 9656353 | Reflow film, solder bump formation method, solder joint formation method, and semiconductor device | Kazuhiro Miyauchi, Naoya Suzuki, Nozomu Takano | 2017-05-23 |
| 8461699 | Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device | Hiroshi Matsutani, Takumi Ueno, Alexandre Nicolas, Ken Nanaumi, Akitoshi Tanimoto | 2013-06-11 |
| 7295376 | Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom | Tetsuro Yamanaka, Kenji Kanemaru | 2007-11-13 |
| 6903160 | Pseudocross-linking resin composition, molded materials, sheet or film made therefrom, and optical elements | Kenji Kanemaru, Koichi Saito | 2005-06-07 |
| 6900273 | Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part | Shuichi Iwata, Tetsuo Yamanaka, Akihiro Yoshida, Keiko Ushikubo | 2005-05-31 |
| 6767967 | Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom | Tetsuro Yamanaka, Kenji Kanemaru | 2004-07-27 |
| 5238730 | Electrical laminate with dibasic acid-modified epoxy (meth)acrylate | Akinori Hanawa, Mitsuo Yokota, Akira Shimizu, Kazuyuki Tanaka | 1993-08-24 |