TU

Takumi Ueno

HI Hitachi: 19 patents #1,906 of 28,497Top 7%
HC Hitachi Chemical Company: 9 patents #162 of 1,946Top 9%
HM Hitachi Chemical Dupont Microsystems: 6 patents #5 of 47Top 15%
RT Renesas Technology: 6 patents #492 of 3,337Top 15%
HC Hitachi Cable: 3 patents #224 of 1,086Top 25%
HS Hitachi Tohbu Semiconductor: 1 patents #126 of 223Top 60%
Overall (All Time): #90,540 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 1–25 of 37 patents

Patent #TitleCo-InventorsDate
9786576 Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device Hiroshi Matsutani, Alexandre Nicolas, Ken Nanaumi 2017-10-10
8852726 Photosensitive polymer composition, method of producing pattern and electronic parts Masayuki Ooe, Hiroshi Komatsu, Yoshiko Tsumaru, Dai Kawasaki, Kouji Katou 2014-10-07
8836089 Positive photosensitive resin composition, method of creating resist pattern, and electronic component Akitoshi Tanimoto, Shigeru Nobe, Kei Kasuya, Hiroshi Matsutani, Yu Aoki +1 more 2014-09-16
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Hiroshi Matsutani, Alexandre Nicolas, Yukihiko Yamashita, Ken Nanaumi, Akitoshi Tanimoto 2013-06-11
8426985 Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component Hiroshi Matsutani, Alexandre Nicolas, Ken Nanaumi 2013-04-23
8304149 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment Masataka Nunomura, Masayuki Ooe, Hajime Nakano, Yoshiko Tsumaru 2012-11-06
8231959 Photosensitive polymer composition, method of producing pattern and electronic parts Masayuki Ooe, Hiroshi Komatsu, Yoshiko Tsumaru, Dai Kawasaki, Kouji Katou 2012-07-31
8097386 Positive-type photosensitive resin composition, method for producing patterns, and electronic parts Hajime Nakano, Noriyuki Yamazaki, Yoshiko Futagawa, Yoshika Satou, Dai Kawasaki 2012-01-17
7851128 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment Masataka Nunomura, Masayuki Ooe, Hajime Nakano, Yoshiko Tsumaru 2010-12-14
7220481 High dielectric constant composite material and multilayer wiring board using the same Yuichi Satsu, Akio Takahashi, Tadashi Fujieda, Haruo Akahoshi 2007-05-22
7217992 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Masahiko Ogino, Shuji Eguchi, Akira Nagai, Toshiya Satoh, Toshiaki Ishii +5 more 2007-05-15
7150947 Photosensitive polymer composition, method of forming relief patterns, and electronic equipment Masataka Nunomura, Masayuki Ooe, Hajime Nakano, Yoshiko Tsumaru 2006-12-19
7038325 Wiring tape for semiconductor device including a buffer layer having interconnected foams Masahiko Ogino, Shuji Eguchi, Akira Nagai, Masanori Segawa, Hiroyoshi Kokaku +6 more 2006-05-02
6940162 Semiconductor module and mounting method for same Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Toshiya Satoh, Masahiko Ogino +3 more 2005-09-06
6924971 High dielectric constant composite material and multilayer wiring board using the same Yuichi Satsu, Akio Takahashi, Tadashi Fujieda, Haruo Akahoshi 2005-08-02
6888230 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Masahiko Ogino, Shuji Eguchi, Akira Nagai, Toshiya Satoh, Toshiaki Ishii +5 more 2005-05-03
6784541 Semiconductor module and mounting method for same Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Toshiya Satoh, Masahiko Ogino +3 more 2004-08-31
6710446 Semiconductor device comprising stress relaxation layers and method for manufacturing the same Akira Nagai, Haruo Akahoshi, Syuji Eguchi, Masahiko Ogino, Toshiya Satoh +2 more 2004-03-23
6710263 Semiconductor devices Toshiyuki Kobayashi, Yasutoshi Kurihara, Nobuyoshi Maejima, Hirokazu Nakajima, Tomio Yamada +1 more 2004-03-23
6638631 Thermal stable low elastic modulus material and device using the same Yuichi Satsu, Morimichi Umino, Akio Takahashi, Akira Nagai, Toshiya Satoh +2 more 2003-10-28
6638352 Thermal stable low elastic modulus material and device using the same Yuichi Satsu, Morimichi Umino, Akio Takahashi, Akira Nagai, Toshiya Satoh +2 more 2003-10-28
6627997 Semiconductor module and method of mounting Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Toshiya Satoh, Masahiko Ogino +3 more 2003-09-30
6579623 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member Yasutoshi Kurihara, Yasuo Kondo, Toshiaki Morita, Kenji Koyama, Takashi Suzumura +2 more 2003-06-17
6433440 Semiconductor device having a porous buffer layer for semiconductor device Masahiko Ogino, Shuji Eguchi, Akira Nagai, Masanori Segawa, Hiroyoshi Kokaku +6 more 2002-08-13
6396145 Semiconductor device and method for manufacturing the same technical field Akira Nagai, Haruo Akahoshi, Syuji Eguchi, Masahiko Ogino, Toshiya Satoh +2 more 2002-05-28