Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9656353 | Reflow film, solder bump formation method, solder joint formation method, and semiconductor device | Naoya Suzuki, Nozomu Takano, Yukihiko Yamashita | 2017-05-23 |
| 7736749 | Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board | Hideo Baba, Nozomu Takano | 2010-06-15 |
| 7166361 | Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board | Hideo Baba, Nozomu Takano | 2007-01-23 |
| 7016749 | System and method for product designing, and recording medium | Seigo Kuzumaki, Yoshio Shirai, Takatoshi Negishi, Masato Kato, Katsuhiko Kato +10 more | 2006-03-21 |
| 6787614 | Thermosetting resin composition and process for producing the same | Nozomu Takano, Hideo Baba | 2004-09-07 |