Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444054 | Semiconductor element mounting structure, and combination of semiconductor element and substrate | Shizu FUKUZUMI, Naoya Suzuki, Toshihisa Nonaka | 2022-09-13 |
| 10893616 | Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board | Tsubasa Inoue, Katsuji Yamagishi, Hiroshi Shimizu | 2021-01-12 |
| 10051743 | Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board | Takahiro Tanabe, Kiyoshi Saitou | 2018-08-14 |
| 7740936 | Adhesion assisting agent fitted metal foil, and printed wiring board using thereof | Nobuyuki Ogawa, Takahiro Tanabe, Kenji Takai, Norio Moriike, Shin Takanezawa +2 more | 2010-06-22 |