Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759440 | Heat-resistant resin paste | Hiroyuki Kawakami, Kouji Yamazaki, Takuya Imai | 2014-06-24 |
| 8404564 | Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them | Yuuki Nakamura, Tsutomu Kitakatsu, Keiichi Hatakeyama | 2013-03-26 |
| 8232185 | Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film | Yuuki Nakamura, Tsutomu Kitakatsu, Keiichi Hatakeyama | 2012-07-31 |