TE

Tetsuya Enomoto

HC Hitachi Chemical Company: 9 patents #162 of 1,946Top 9%
SC Sanyo Electric Co.: 7 patents #794 of 6,347Top 15%
HM Hd Microsystems: 5 patents #1 of 17Top 6%
DE Denso: 3 patents #3,857 of 11,792Top 35%
MT Mirise Technologies: 3 patents #19 of 133Top 15%
TO Toyota: 3 patents #8,352 of 26,838Top 35%
ND Nisshinbo Micro Devices: 2 patents #3 of 32Top 10%
HM Hitachi Chemical Dupont Microsystems: 2 patents #19 of 47Top 45%
HD Hitachi Displays: 1 patents #519 of 752Top 70%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
Nissan Motor Co.: 1 patents #4,519 of 8,689Top 55%
HC Hitachi Device Engineering Co.: 1 patents #292 of 514Top 60%
Overall (All Time): #127,939 of 4,157,543Top 4%
29
Patents All Time

Issued Patents All Time

Showing 1–25 of 29 patents

Patent #TitleCo-InventorsDate
12386256 Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component Atsutaro YOSHIZAWA, Satoshi Yoneda, Akira Asada, Masayuki Ohe 2025-08-12
12386257 Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component Shingo Tahara, Nobuyuki Saito, Daisaku MATSUKAWA 2025-08-12
12336434 Piezoelectric film layered structure and method for producing thereof Akihiko Teshigahara 2025-06-17
12294832 Microelectromechanical systems device Yuki Ohara, Tomoya Joke, Hideo Yamada, Shuji Katakami, Takahide Usui +2 more 2025-05-06
12294831 Electroacoustic transducer Tomoya Joke, Hideo Yamada, Shuji Katakami, Takashi Kakefuda, Takahide Usui 2025-05-06
11807721 Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component Satoshi Yoneda 2023-11-07
11487201 Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component Etsuharu Tsuchiya, Takashi Kawamori, Nobuyuki Saito, Yukari Koibuchi, Atsutaro YOSHIZAWA +1 more 2022-11-01
11048167 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component Daisaku MATSUKAWA 2021-06-29
10725379 Polymide precursor resin composition Keishi ONO, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki 2020-07-28
9751984 Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition Keishi ONO, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki 2017-09-05
9431314 Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device Emi MIYAZAWA, Kazutaka Honda, Akira Nagai, Keisuke Ookubo 2016-08-30
9129898 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device Kazutaka Honda, Yuuki Nakamura 2015-09-08
9123734 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Kazutaka Honda, Yuuki Nakamura 2015-09-01
9024455 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device Kazutaka Honda, Yuuki Nakamura 2015-05-05
8674502 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device Kazutaka Honda, Yuuki Nakamura 2014-03-18
8034659 Production method of semiconductor device and bonding film Akira Nagai, Masaaki Yasuda, Keiichi Hatakeyama 2011-10-11
8028402 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof Hidehiro Nakamura, Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Norio Moriike +1 more 2011-10-04
7907232 Liquid crystal display device 2011-03-15
7704799 Method of manufacturing wiring substrate Hidehiro Nakamura, Toshio Yamazaki, Hiroshi Kawazoe 2010-04-27
7488521 Resinous tube Katsumi Morohoshi, Hiroshi Kumagai 2009-02-10
7439991 Image information presentation system, image information presentation method, medium storing image information presentation system program, and signal therefor Kenji Taima, Teruhiro Yamada, Ryuhei Amano, Satoshi Takemoto 2008-10-21
7205645 Wiring board, semiconductor device, and method of manufacturing wiring board Hidehiro Nakamura, Toshio Yamazaki, Hiroshi Kawazoe 2007-04-17
6747610 Stereoscopic image display apparatus capable of selectively displaying desired stereoscopic image Kenji Taima, Ryuhei Amano 2004-06-08
6553184 Method of converting two dimensional images into three-dimensional images Takahisa Ando, Teruhiro Yamada, Nobuaki Uwa 2003-04-22
6336210 Panel-presentation-software creation method, computer-readable record medium recording a panel-presentation-software creation program, and panel-presentation-software creation device Kenji Taima, Teruhiro Yamada, Satoshi Takemoto, Ryuhei Amano 2002-01-01