Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608455 | Adhesive for semiconductor device, and high productivity method for manufacturing said device | Kazutaka Honda, Koichi CHABANA, Akira Nagai | 2023-03-21 |
| 10725379 | Polymide precursor resin composition | Tetsuya Enomoto, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki | 2020-07-28 |
| 10669454 | Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer | Kazutaka Honda, Koichi CHABANA, Akira Nagai | 2020-06-02 |
| 10224311 | Semiconductor adhesive, and semiconductor device and method for manufacturing same | Kazutaka Honda, Akira Nagai, Makoto Satou, Koichi CHABANA | 2019-03-05 |
| 9751984 | Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition | Tetsuya Enomoto, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki | 2017-09-05 |
| 9134608 | Positive photosensitive resin composition, method for producing patterned cured film and electronic component | Masashi Kotani, Masayuki Ooe, Taku Konno, Tomonori Minegishi | 2015-09-15 |