Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10456731 | CO2 concentration reducing device | Kohei Yoshikawa, Masato Kaneeda, Toshiaki Shirasaka | 2019-10-29 |
| 10456743 | Exhaust-gas treatment equipment and gas-capture-material deterioration-state estimating method | Kohei Yoshikawa, Masato Kaneeda | 2019-10-29 |
| 10035099 | CO2 removal device | Kouhei Yoshikawa, Masato Kaneeda, Toshiaki Shirasaka | 2018-07-31 |
| 9209538 | Memory card connector | Kazuta Yoshida, Yoshifumi Okabe | 2015-12-08 |
| 8864525 | Memory card connector | — | 2014-10-21 |
| 8839513 | Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interpolated cylinder | — | 2014-09-23 |
| 8648605 | Sensor, sensor system, portable sensor system, method of analyzing metal ions, mounting substrate, method of analyzing plating preventing chemical species, method of analyzing produced compound, and method of analyzing monovalent copper chemical species | Tooru Nakamura, Yutaka Hayashi, Yuji Kawanishi | 2014-02-11 |
| 8535623 | Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder | — | 2013-09-17 |
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Akishi Nakaso, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike +1 more | 2011-10-04 |
| 7874848 | Connector for inserting wiring board, and method for manufacturing the same | — | 2011-01-25 |
| 7704799 | Method of manufacturing wiring substrate | Tetsuya Enomoto, Toshio Yamazaki, Hiroshi Kawazoe | 2010-04-27 |
| 7205645 | Wiring board, semiconductor device, and method of manufacturing wiring board | Tetsuya Enomoto, Toshio Yamazaki, Hiroshi Kawazoe | 2007-04-17 |
| 6800685 | Polyester resin composition for engine peripheral parts | Nori Yoshihara, Satoshi Kosugi, Kenjiro Ogami, Yutaka Ogasawara, Masahiro Ogata +2 more | 2004-10-05 |
| 6761569 | Card connector device | — | 2004-07-13 |
| 6568073 | Process for the fabrication of wiring board for electrical tests | Naoki Fukutomi, Hajime Nakayama, Yoshiaki Tsubomatsu, Masanori Nakamura, Kouichi Kaitou +3 more | 2003-05-27 |
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Yoshiaki Tsubomatsu +4 more | 2001-05-22 |
| 6133534 | Wiring board for electrical tests with bumps having polymeric coating | Naoki Fukutomi, Hajime Nakayama, Yoshiaki Tsubomatsu, Masanori Nakamura, Kouichi Kaitou +3 more | 2000-10-17 |
| 6062904 | PC card connector | Wataru Oguchi, Kazuki Satou | 2000-05-16 |
| 6064111 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Yoshiaki Tsubomatsu +4 more | 2000-05-16 |
| 6042401 | Connector device for IC card | Wataru Oguchi, Kazuki Satou | 2000-03-28 |
| 6015309 | PC card connector | Kazuki Satou, Wataru Oguchi | 2000-01-18 |
| 5880405 | Terminal structure for electronic part with stepped offset portions | Yasunari Takano, Tetsuya Furusawa | 1999-03-09 |
| 5738532 | Connector pin contact | Yasunari Takano, Shin Yoshida, Akito Miura, Koichi Takahashi, Kazuki Satou | 1998-04-14 |
| 5735042 | Method of fabricating connector pin contact | Yasunari Takano, Shin Yoshida, Akito Miura, Koichi Takahashi, Kazuki Satou | 1998-04-07 |
| 5725385 | PC card connector | Yasunari Takano, Shin Yoshida | 1998-03-10 |