Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11001690 | Cushion material, seat cushion material, and seat | Kunikazu Takiwaki, Kunio Asobe, Hiroyuki Orito, Takaharu Matsuo, Kiyoshi Ota +3 more | 2021-05-11 |
| 6331576 | Surface-decorated foam skin of cross-linked rubbery soft olefin resin | Koichi Kusakawa | 2001-12-18 |
| 6331729 | Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them | Masami Yusa, Toshihiko Kato, Fumio Inoue | 2001-12-18 |
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2001-05-22 |
| 6064111 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2000-05-16 |
| 5972492 | Foamed pad material for low-pressure compression molding | Masaharu Murakami, Akira Uchiyama, Koichi Kusakawa, Shinobu Haga | 1999-10-26 |
| 5319005 | Epoxy resin molding material for sealing of electronic component | Shinsuke Hagiwara, Hiroyuki Kuriya | 1994-06-07 |