Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7187072 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Shinsuke Hagiwara +2 more | 2007-03-06 |
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Shinsuke Hagiwara +2 more | 2004-06-08 |
| 6365432 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Shinsuke Hagiwara +2 more | 2002-04-02 |
| 5976912 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Shinsuke Hagiwara +2 more | 1999-11-02 |
| 5504992 | Fabrication process of wiring board | Naoki Fukutomi, Yoshiaki Tsubomatsu, Toshio Yamazaki, Masahiko Itabashi | 1996-04-09 |