Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11208525 | Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound | Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Shinichi Kosugi | 2021-12-28 |
| 10941241 | Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product | Kenji Tanaka, Yuka Yoshida, Shinichi Kosugi, Shingo Tanaka, Hideyuki Katagi +1 more | 2021-03-09 |
| 10934387 | Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound | Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Shinichi Kosugi | 2021-03-02 |
| 10662279 | Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article | Yuka Yoshida, Kenji Tanaka, Hideyuki Katagi, Yoshihiro Amano, Shinichi Kosugi +1 more | 2020-05-26 |
| 10000679 | Phenolic resin composition | Shinichi Kosugi, Yoshitaka Takezawa, Hiroyuki Takahashi, Naoki Hara | 2018-06-19 |
| 8642714 | Phenol resin and resin composition | Kuniaki Satou, Osamu Matsuzaka | 2014-02-04 |
| 7504471 | Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive | Takashi Kumaki, Hideyasu Tsuiki, Hiroshi Matsutani, Toshihiko Takasaki, Iwao Fukuchi | 2009-03-17 |
| 7491789 | Disulfide-containing phenolic resin as curing agent for epoxy resin | Takashi Kumaki, Hideyasu Tsuiki, Hiroshi Matsutani, Toshihiko Takasaki, Iwao Fukuchi | 2009-02-17 |
| 6713589 | Phenyl, naphthly or fluorene cyclopentyl epoxy resins | Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama | 2004-03-30 |
| 6329492 | Phenyl, naphthyl or fluorene cyclopentyl epoxy resins | Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Akihiro Kobayashi, Hideki Yokoyama | 2001-12-11 |
| 6207789 | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device | Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Kazuyoshi Tendo | 2001-03-27 |
| 6194491 | Biphenyl epoxy resin, naphthalene-containing phenolic resin and accelerator triphenylphosphine/p-benzoquinone | Masanobu Fujii, Shinya Yamada | 2001-02-27 |
| 5510446 | Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts | Shinsuke Hagiwara, Hiroyuki Saitoh | 1996-04-23 |
| 5459223 | Method of preparing naphthol-modified phenolic resin | Shinsuke Hagiwara, Hiroyuki Saitoh | 1995-10-17 |
| 5206333 | Method of producing a naphthol-modified phenolic resin of highly increased molecular weight | Ken Nanaumi, Takuji Itou, Ken Madarame, Shinsuke Hagiwara | 1993-04-27 |