Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846998 | Sealant epoxy-resin molding material, and electronic component device | Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou, Ryouichi Ikezawa | 2010-12-07 |
| 6713589 | Phenyl, naphthly or fluorene cyclopentyl epoxy resins | Haruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Akihiro Kobayashi, Hideki Yokoyama | 2004-03-30 |
| 6329492 | Phenyl, naphthyl or fluorene cyclopentyl epoxy resins | Haruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Akihiro Kobayashi, Hideki Yokoyama | 2001-12-11 |
| 6207789 | Phenolic resin, resin composition, molding material for encapsulation, and electronic component device | Haruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Kazuyoshi Tendo | 2001-03-27 |