Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11767449 | Epoxy resin composition and electronic component device | Hirokuni Ogihara, Fumio Furusawa, Shinya Nakamura, Takashi Yamamoto | 2023-09-26 |
| 10865332 | Epoxy resin composition and electronic component device | Hirokuni Ogihara, Fumio Furusawa, Shinya Nakamura, Takashi Yamamoto | 2020-12-15 |
| 7846998 | Sealant epoxy-resin molding material, and electronic component device | Seiichi Akagi, Mitsuo Katayose, Yoshinori Endou, Ryouichi Ikezawa | 2010-12-07 |