Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846998 | Sealant epoxy-resin molding material, and electronic component device | Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou | 2010-12-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846998 | Sealant epoxy-resin molding material, and electronic component device | Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou | 2010-12-07 |