Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7846998 | Sealant epoxy-resin molding material, and electronic component device | Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Ryouichi Ikezawa | 2010-12-07 |
| 7397139 | Epoxy resin molding material for sealing use and semiconductor device | Ryoichi Ikezawa, Naoki Nara, Hideyuki Chaki, Yoshihiro Mizukami, Takaki Kashihara +4 more | 2008-07-08 |